| Time | Topic | Guest |
|---|---|---|
| 9:00-9:45 | Check-in and socializing | |
| 9:45-9:50 | Host's Opening Speech | |
| 09:50-10:15 | Momentive Electronic Adhesive Solutions | Ma Lei |
| 10:15-10:40 | WACKER Silicones' Integrated Solutions for Thermal Management in Telecommunications: TIM1/TIM2 and Immersion Cooling | Steven Hu |
| 10:40-11:05 | MEMS and Semiconductor Chip Bonding Solutions | Song Qi |
| 11:05-11:30 | Introduction to the Application of Silicone Materials in Chip Packaging | Zhao Yi |
| 11:30-11:55 | Abnen TIM Solutions | Yi Yuping |
| 11:55-12:20 | Automotive Chip Industry Sharing and Adhesive Solutions | Xia Hao |
| 12:20-13:30 | Lunch Break | |
| 13:30-13:55 | Application of High Shear Blue Adhesive in New Energy Area | Xu Jingde |
| 13:55-14:20 | MacDermid Alpha Adhesive Solutions for Automotive Electronics Applications | Long Yao |
| 14:20-14:45 | Silicone Thermal Conductive and Heat Resistant Materials | Dr. Zhang Shizhong |
| 14:45-15:10 | Development Status and Challenges of Advanced Semiconductor Packaging Technology and Key Packaging Materials | Chen Tian'an |
| 15:10-15:35 | Development and Applications of High-Performance Adhesives in the Big Data Era | Lu Wenye |
| 15:35-16:00 | Applications of Adhesives in High-Reliability Scenarios | Zhang Jiayun |
© Messe Muenchen Shanghai Co., Ltd.
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